When the glass phase had a low Tg, Tm, and a stronger wettability with aluminum, molted glass was easier to flow to the surface of sintered silver. The surface glass wrapped and infiltrated aluminum powders, causing a non-conductive glass layer of aluminum particles, thus hindering the current transmission from the silver to aluminum and resulting a high contact resistance value.If the glass frit had a high Tg, Tm, and light wettability with aluminum, the content of glass which flowed to the surface of the sintered silver was low. Therefore, the Ag/AI interface could have a good contact formation, finally causing a lower contact resistance.High content glass in Ag paste was beneficial for the formation of Ag precipitation which allowed the electron hopping and improved the electrical conductivity, thus the Ag/AI contact resistance was decreased with the increase of glass content in Ag paste.