The Cu/Co multilayers play an important role in giant magnetoresistance(GMR).The research had shown that grain size, microstructure and orientation distribution have strong effects on performance and stability of thinfilm device.In this study, we investigated the texture characteristic of each layer and the interface structure in Cu/Co multilayers whichwith Ti underlayerdeposited on SiO2 substrate by means of magnetron sputtering method.The X-ray diffractometer(XRD) was used to measure the pole figures of Cu/Co multilayers, and themicrostructure was observed from transmission electron microscope (TEM).The experimental results showed that there was a {0001 } fiber texture both in the Ti underlayer and Co layer and a { 111 } fiber texture in the Cu layer.Meanwhile the texture inheritedwas existed in the Cu/Co multilayers with Ti underlayer.It is means that the texture of Cu and Co layer were strong which grew on a high orientation Ti underlayer.The orientation relationship between Cu and Co layer was { 111 } / { 0002 } according to the selected areadiffraction pattern of Cu/Co interface.TEM micrograph of Cu/Co multhilayers revealed that the columnar grain structure was formedduring film growth both in Cu and Co layer, and the misorientation between two grains in Cu layer was always 60.