2. 您的位置
3. 首页
4. 会议论文
5. Comparison of Electrical Characteristics of a Toroidal and Straight Type Reactor

Comparison of Electrical Characteristics of a Toroidal and Straight Type Reactor

来源 :2011年第三届微电子及等离子体技术国际会议 | 被引量 : 0次 | 上传用户：huanghoubin102

【摘 要】

：

Transformer Coupled Plasma(TCP) is different from well known Inductively Coupled Plasma(ICP),because the former has a magnetic core between the primary coil and the secondary coil.

【作 者】

：

Daeho You S. K. Ahn Hong-Young Chang 

【机 构】

：

KAIST, 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Rep. of Korea

【出 处】

：

2011年第三届微电子及等离子体技术国际会议

【发表日期】

：

2011年9期

【关键词】

：

Electrical characteristics Transformer Coupled Plasma Ferrite 

下载到本地 , 更方便阅读

下载此文 赞助VIP

声明 : 本文档内容版权归属内容提供方 , 如果您对本文有版权争议 , 可与客服联系进行内容授权或下架

论文部分内容阅读

Transformer Coupled Plasma(TCP) is different from well known Inductively Coupled Plasma(ICP),because the former has a magnetic core between the primary coil and the secondary coil.

其他文献

An analysis of E×B drift movement in the SH4 plasmas included negatively charged nanoparticles

The negatively charged nanoparticles are generated for prepare the silicon thin films in the SH4 plasma.It has been recognized that the nanoparticles contamination is a major problem in plasma process

会议

silicon nanoparticlesnegatively charged ionE×B drift

Time- and Space-Resolved Characteristics of Ozone Concentration in Atmospheric Pressure Plasma using

Atmospheric pressure plasmas have been given much attention because of its cost performance and various possibilities for industrial applications.In general,atmospheric plasmas are maintained by the s

会议

Atmospheric Pressure PlasmaUltra Short PulseOzoneSpatial Profile

Numerical Calculation of Spatial Electric Field by RF Bias in High Density Plasmas

In this study,numerical calculation of the spatial electric field induced by biased electrode of 13.56 MHz was performed in high density plasmas.

会议

numerical calculationhigh density plasmasspatial electric fieldskin effect

Development of a large RF plasma source for dust removal

To remove the dust particles about 100 cm long within the vacuum chamber,we have developed a large rectangular plasma device with size of 120(L) x 50(W) x 44(H) cm^3.

会议

Dust removalRF antennaelectric curtain

Discharge Formation Mechanisms of Nano-Second High-Pressure Hydrogen Discharges

Dynamic processes of capacitively-coupled hydrogen plasmas generated by fast-rising pulsed high voltages at near-atmospheric pressure have been studied with the use of Particle-in-Cell (PIC) simulatio

会议

Atmospheric Pressure DischargeParticle-in-Cell SimulationHydrogen Discharge

Fast Measurement using Fourier Analysis of Cutoff Probe

Wave-cutoff method is an electron density measurement tool.In this method,an electron density can be acquired from the transmission spectra analysis of plasma.

会议

cutoff probeprocessing plasmaplasma monitoring

Abrupt Changes in Neon Discharge Plasma Detected Via the Optogalvanic Effect

When a laser is tuned between two excited energy levels of a gas in a DC discharge lamp,the discharge current will experience a temporary disturbance lasting tens or hundreds of microseconds known as

会议

Plasma diagnostics Optogalvanic Effect Discharge Plasma

Highly dissipative shear flow instability at the interface of a two-stream complex plasma

Complex Plasmas as the (,,)plasma state of soft matter" allow the study of fluid dynamics at the level of single particle kinetics.

会议

Complex PlasmasFlow InterfaceInstabilityKinetic Study

The Spatial Distribution and Propagation Characteristics of Vacuum Discharge Plasma

Metal plasma is composed of metal ions produced by diffuse arc.The metal ions possess some special properties such as orientational movement and so on.

会议

VacuumPlasmaProbe methodSpatial distributionPropagation

Numerical study of the Plasma Chemistry in Inductively Coupled SF6 and SF6 /Ar Plasmas Used for Deep

Inductively coupled plasmas (ICPs) produced in SF6 and its mixtures with other gases (Ar,O2,CF4,SiCl4,…) have been widely used for Si etching in a variety of applications,especially for deep trench et

会议

Plasma simulationSF6 plasmaEtching applicationHybrid model