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采用真空热压烧结在不同工艺参数下制备SiC颗粒体积分数分别为10%,20%,30%,40%的SiCp/ZL101A复合材料,研究烧结温度、保温时间等工艺参数对SiCp/ZL101A复合材料显微组织的影响以及SiC含量对SiC颗粒在基体ZL101A中分布均匀性的影响,同时对SiCp/ZL101A复合材料界面进行透射电镜显微分析。结果显示,随着烧结温度的增加,组织致密度增加,气孔数量及尺寸减小;保温时间的增加导致复合材料平均晶粒尺寸的增加;随着SiC颗粒体积分数的增加,SiC颗粒在基体ZL101A中分布均匀性变差;固相烧结法制备的SiCp/ZL101A复合材料中没有出现界面反应现象。
The SiCp / ZL101A composites with 10%, 20%, 30% and 40% SiC particles were prepared by vacuum hot-pressing sintering under different technological parameters. The effects of sintering temperature and holding time on the mechanical properties of SiCp / The influence of microstructure and the influence of SiC content on the distribution uniformity of SiC particles in matrix ZL101A were investigated. Meanwhile, the interface of SiCp / ZL101A composites was analyzed by transmission electron microscopy. The results show that with the increase of sintering temperature, the density of the microstructure increases and the number and size of pores decreases. The increase of the holding time leads to the increase of the average grain size of the composite. With the increase of SiC particle volume fraction, In the distribution uniformity of SiCp / ZL101A composites prepared by solid-state sintering did not show any interfacial reaction phenomenon.