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针对组合式片状放大器(MSA)只能进行被动热恢复的现状,研究了放大器中各关键单元器件的热恢复时序。结果表明,抽运结束后,钕玻璃和隔板玻璃之间的热传递存在交互变化的特点,在隔板玻璃升温之前采用主动冷却可消除钕玻璃主要热源。提出了采用延时全腔水冷的设计,从而在不影响放大器效率的基础上实现了主动热恢复,并就典型放大器给出了延时参数。
In view of the fact that the combined chip amplifier (MSA) can only perform passive thermal recovery, the thermal recovery timing of each key unit in the amplifier is studied. The results show that after the pumping, the heat transfer between neodymium glass and separator glass has the characteristic of interaction. Active cooling can be used to eliminate the main heat source of neodymium glass before the separator glass is heated. The design of time delay full cavity water cooling is proposed, which realizes active thermal recovery without affecting the efficiency of the amplifier and gives the delay parameter for the typical amplifier.