中国台湾在半导体产业上的IC封装测试业产量已排名世界第一,技术与美国、日本、韩国并驾齐驱。长期接触微电子封装研究的高雄县私立大学校长傅胜利称,台湾产学界致力于多层电路板研究取得的成绩,让人刮目相看,享誉全球。据统计,2003年全世界前六大封装测试公司,中国台湾就占有前几名。中国台湾的日月光半导体公司(ASE)已超越原 China Taiwan in the semiconductor industry IC packaging and testing industry has ranked the world’s first production, technology and the United States, Japan, South Korea keep pace. Fu Shengli, principal of Kaohsiung County Private University who has been in contact with the microelectronics packaging research for a long time, said that Taiwan’s industry and academia are devoted themselves to the achievements made in the research of multi-layer circuit boards. According to statistics, in 2003 the world’s top six packaging and testing companies, China Taiwan occupy the top few. Taiwan’s ASE Semiconductor (ASE) has surpassed the original