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制造一种新型大功率发光二极管(LED)相变热沉作为封装级散热元件,采用犁切?挤压成形的周向螺旋状微沟槽和采用冲压成形的放射状径向沟槽组成的三维结构作为蒸发面强化沸腾结构,内壁采用铜粉颗粒烧结而成的毛细芯结构为工质提供循环动力。测试了相变热沉在不同输入功率和工质条件下的运行特性。结果表明,相变热沉具有良好的传热能力,在环境温度为20°C,输入功率为10W的条件下,相变热沉最高温度为86.8°C,可满足功率为10W的LED封装散热需求。
A novel high-power light-emitting diode (LED) phase-change heatsink is fabricated as a package-level heat sink. A three-dimensional structure consisting of plow-cut and extrusion circumferential helical microgrooves and press-formed radial radial grooves As the evaporation surface enhanced boiling structure, the inner wall using copper powder particles sintered core structure to provide circulating fluid power. The operating characteristics of phase change heat sink under different input power and working conditions were tested. The results show that the phase change heat sink has good heat transfer capability. Under the condition of 20 ° C ambient temperature and 10W input power, the maximum temperature of phase change heatsink is 86.8 ° C, which can meet the requirement of 10W LED package demand.