论文部分内容阅读
半导体测试公司惠瑞捷(Verigy)旗下全资子公司Touchdown Technologies推出了其1Td300全晶圆探卡,这是该公司首款用于高级DRAM存储器件单次触压、高容量测试的探卡。该产品能够对300 mm或200 mm晶圆进行高并行测试(highly parallel tesTIng)。每探针只需要2g压力就能够测试整个300 mm晶圆,堪称业界最低的探针压力,所需压力不到市面上同类产品的一半。1Td300探卡提供了双重优势,不仅能够降低对被测晶圆和整个测试台的压力,同时允许更高的引脚数,以拓展半导体测试范围。《国际半导体技术蓝图》(ITRS)预计,到2011年,DRAM的多
Touchdown Technologies, a wholly owned subsidiary of Verigy, a semiconductor testing company, introduced its 1Td300 full wafer probing card, the company’s first probe card for single-touch, high-capacity testing of advanced DRAM memory devices. The product is capable of highly parallel tesTIng on 300 mm or 200 mm wafers. Each probe requires only 2g of pressure to be able to test the entire 300mm wafer, making it the industry’s lowest probe pressure and requiring less than half the pressure on the market. The 1Td300 probe offers the dual benefit of not only reducing pressure on the wafer under test and the entire test bench, but also allowing for higher pin counts to extend the semiconductor test range. The International Technology Roadmap for Semiconductors (ITRS) predicts that by 2011 there will be more DRAM