采用快速凝固与热锻相结合的方法,制备组织均匀、晶粒细小的Cu?0.15Zr(质量分数,％)合金,研究高温退火过程中合金显微组织演变、力学性能和电导率.该合金表现出良好的热稳定性,即使在700℃退火2 h后,合金强度仅轻微下降.退火过程中纳米级连续分布的Cu5Zr析出相对位错运动起到钉扎作用,从而使基体强化,同时,尺寸较大的颗粒状Cu5Zr析出相通过钉扎晶界阻碍晶粒长大.在700℃退火2 h后,由于空位、位错、晶界以及基体中溶质Zr原子减少,合金电导率达到峰值88％(IACS).“,”Cu?0.15Zr (wt.％) alloy with uniform and fine microstructure was fabricated by rapid solidification followed by hot forging. Evolution of microstructure, mechanical properties and electrical conductivity of the alloy during elevated-temperature annealing were investigated. The alloy exhibits good thermal stability, and its strength decreases slightly even after annealing at 700 ℃ for 2 h. The nano-sized Cu5Zr precipitates show significant pinning effect on dislocation moving, which is the main reason for the high strength of the alloy. Additionally, the large-size Cu5Zr precipitates play a major role in retarding grain growth by pinning the grain boundaries during annealing. After annealing at 700 ℃ for 2 h, the electrical conductivity of samples reaches the peak value of 88％ (IACS), which is attributed to the decrease of vacancy defects, dislocations, grain boundaries and Zr solutes.