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硅元件产品,SiMoAl在680℃5×10~(-5)真空条件下烧结在一起,再进行表面磨角。目前,各硅元件厂的磨角工序;大都是用手指压着钼硅焊结的片子在磨角器上研磨。这样工人手指很容易疲劳,特别是直径小的片子,只能用一个手指压着片子磨;手指既累,产量也很低。现在设计了一个小工具,如图所示:既能减轻工人劳动强度,又能提高产量2～3倍,特别适用于一些批量小、品种杂的中小型厂家。
Si elemental products, SiMoAl sintered at 680 ℃ under 5 × 10 ~ (-5) vacuum conditions, and then polished surface angle. At present, the grinding process of each silicon component factory is mostly carried out by pressing the molybdenum-silicon soldering sheet with a finger on the polisher. This worker’s finger is very easy to fatigue, especially small diameter film, can only be pressed with a finger film mill; finger tired, yield is very low. Now designed a small tool, as shown: not only reduce the labor intensity of workers, but also improve the yield of 2 to 3 times, especially for some small batch, small and medium variety of small and medium-sized manufacturers.