在半导体器件制作中,须将晶片清洗后才进行工艺操作。随着构成器件各部分尺寸逐步缩小,结构日趋复杂,集成度不断增加,对净化的要求也相应提高。为此,需要不断探索新型净化剂和净化装置及其方法。同时,还必须加强污染表面的分析研究。 In the manufacture of semiconductor devices, the wafer must be cleaned before proceeding with the process. As the size of each part of the device is gradually reduced, the structure is becoming more and more complex, the integration is increasing, and the requirements for purification are correspondingly raised. To do this, there is a need to continually explore new scavengers and purification devices and methods thereof. At the same time, we must also strengthen the analysis of the pollution surface.