论文部分内容阅读
在微电子封装技术发展过程中,封装用胶的分配技术正从接触式向非接触式过渡,尤其是作为非接触式分配技术代表的微滴喷射技术的出现,使高精度按需分配成为可能,而高性能的封装用胶一般具有较高的黏度,采用传统的非接触式分配技术并不能满足其黏度特性要求.本文通过研究,提出了一种机械式高黏度流体微量喷射系统,其核心是通过阀杆相对于阀座的运动,带动并将一部分流体从喷嘴中挤出.通过实验研究发现,影响该系统喷射质量的主要因素包括阀杆的行程、气缸驱动压力、弹簧预压、供料腔背压以及流体工作温度等.本文在研究中采用0.2mm不锈钢喷嘴,得到了最小直径为0.35mm的胶点.
In the development of microelectronic packaging technology, the dispensing technology of encapsulated glue is changing from contact to non-contact, and especially the emergence of droplet ejecting technology represented by non-contact dispensing technology makes high-precision on-demand distribution possible , While the high-performance encapsulant glue generally has higher viscosity, the traditional non-contact dispensing technology can not meet the requirements of its viscosity characteristics.This paper presents a mechanical high viscosity fluid micro-injection system, the core of which Through the movement of the valve stem relative to the valve seat, drives and squeezes a part of the fluid out of the nozzle.Through the experimental study, it is found that the main factors that affect the injection quality of the system include the stroke of the stem, the driving pressure of the cylinder, the spring preload, Cavity back pressure and fluid working temperature, etc .. In this study, 0.2mm stainless steel nozzle was used in this study, and the minimum diameter of 0.35mm gel point was obtained.