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日本信越化学工业公司研制成功了一种能够大幅度提高耐湿性、应力和热冲击性能的IC 和 LSI 塑料封装用的新型环氧树脂,它可以在低压下成型。与以往的环氧树脂相比,据压力-潮热腐蚀试验的结果,平均寿命时间可延长2～3倍,为330～350hr;应力大约减少一半,在成型退火后,硅片上的应力,KMC-140和KMC-140C 分别为0.43和0.55Kg/mm~2;在-50～+150℃的温度循环试验中(每次为30分钟),KMC-140C 可经受250次,KMC-140可经受1000次循环,外引线都不断裂。
Shin-Etsu Chemical Co., Ltd. succeeded in developing a new type of epoxy resin for IC and LSI plastic packages capable of drastically improving moisture resistance, stress and thermal shock resistance, which can be molded at low pressure. Compared with the previous epoxy resin, according to the result of the pressure-hot-hot corrosion test, the average life time can be prolonged by 2-3 times to 330-350hr; the stress can be reduced by about half; after forming annealing, the stress on the silicon wafer, KMC-140C and KMC-140C respectively 0.43 and 0.55Kg / mm ~ 2; KMC-140C can withstand 250 times in temperature cycling test at -50 ~ + 150 ℃ Withstand 1000 cycles, the outer lead is not broken.