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载带自动键合(TAB)是一种封装技术,该技术使用了一种覆有金属引线框架的聚酰亚胺带。裸露的芯片被键合到内引线框架上,而键合好的引线框架/管芯或是被单个地置于载体上或是被送到卷带上的定位/键合装置上。图1是一个装在典型的内引线框架上的单个载带自动键合的示意图。 TAB、带式封装、微封装和PILL封装的引线均不穿过电镀通孔(PTH),这一点与SMT相似。不同的是,SMT的典型间距在0.020～0.050in之间,而载带引线则在0.008～0.020in之间,属于精细间距技术(FPT)。
Tape Automated Bonding (TAB) is a packaging technology that uses a polyimide tape covered with a metal leadframe. The bare chip is bonded to the inner lead frame while the bonded lead frame / die is either placed singly on a carrier or on a tacking / bonding device on the tape. Figure 1 is a schematic view of a single carrier tape auto-bond mounted on a typical inner lead frame. TAB, tape and tape, micro-packaging and PILL package leads do not pass through the through-hole (PTH), similar to the SMT. The difference is that SMT typical spacing between 0.020 ~ 0.050in, while the carrier lead is between 0.008 ~ 0.020in, are fine pitch technology (FPT).