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研究银粉含量和印刷阴极型聚合物发光二极管(polymer light-emitting diode,PLED)之间的构-效关系.实验比较两种不同银粉含量的导电银胶,通过刮涂法制备PLED的阴极.两种银胶的胶体基底相同,区别在于银粉颗粒的含量不同.实验研究银粉的分布状态与器件性能之间的关系.结果表明,银胶中的银粉含量越高,器件的性能越好,主要体现在驱动电压更低、电流密度更大和量子效率更高.偏光显微镜图片显示,提高银胶中银粉的含量,可以优化银粉在印刷阴极/电子传输层之间的分布.通过银粉覆盖率的数据模拟也证明了这一点.为确定银粉覆盖率的提高能够优化器件效率,在器件中通过蒸镀添加薄银层.结果表明,由于薄银层的插入,器件的驱动电压随之下降,器件性能也得到优化.因此,在印刷型的PLED器件中,提高银胶中银粉的含量可以有效减低载流子的注入势垒,达到器件优化的效果.
The relationship between silver content and printed PLED was studied by comparing two different conductive silver pastes with different silver contents and the cathode of PLED by blade coating method. The colloid substrates of the silver colloids are the same except that the content of the silver colloids is different.The relationship between the silver colloidal distribution and the device properties is experimentally studied.The results show that the higher the silver colloids content, the better the performance of the device Lower driving voltage, higher current density and higher quantum efficiency.Photomicroscope images show that increasing the silver content in the silver paste can optimize the silver powder distribution between the printed cathode / electron transport layers.By simulating the silver powder coverage Also proved this point.In order to confirm the improvement of the coverage of silver powder, the efficiency of the device can be optimized, and the thin silver layer is added by evaporation in the device.The results show that the driving voltage of the device decreases due to the thin silver layer insertion, Therefore, in a printed PLED device, increasing the content of the silver powder in the silver paste can effectively reduce the carrier injection barrier to achieve device-optimized efficiency .