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本文为了适应21世纪初期超大规模集成电路发展的需要,提出了预测空气含尘浓度的方法。建立了空气含尘浓度C和空气粒子最大允许值E之间的关系式,计算出和IC集成度相对应的圆片加工区的空气含尘浓度C值。
In order to meet the needs of the development of ultra-large-scale integrated circuits in the early 21st century, this paper proposes a method to predict the concentration of dust in air. The relationship between the airborne dust concentration C and the maximum allowable air particle E is established, and the C value of air dust concentration in the wafer processing zone corresponding to the IC integration is calculated.