着重分析了晶圆表面残留颗粒对晶圆键合的影响,并从表面残留颗粒统计意义的角度,得到了一个晶圆键合的判定标准。为了改善键合界面出现的气泡问题,一种基于点压技术的新型点压键合法被应用到整片键合中,并和传统的金金热压键合法进行了比较。实验表明,采用点压键合法能够有效抑制晶圆表面残留颗粒对晶圆键合的影响。 The influence of residual particles on the wafer bonding is analyzed emphatically, and a criterion of wafer bonding is obtained from the statistical significance of the residual particles on the surface. In order to improve the bubbles in the bonding interface, a new type of point-and-click bonding method based on point-pressure technology is applied to the whole sheet bonding and compared with the traditional hot-gold-gold bonding method. Experiments show that the use of point-pressure bonding method can effectively inhibit the wafer surface residual particles on the wafer bonding.