现在许多研究群体在运用“温”超导材料匆忙地制作实验性的集成线路设备,这些超导芯片必将成为新一代超导计算机和其他电子设备的基础。但是制作这些超导设备过程的不稳定使人很伤脑筋,今天可以这样做,可能明天就不行。 Many research groups are now hurrying to make experimental integrated circuit devices using “warm” superconducting materials that will surely underlie the new generation of superconducting computers and other electronic devices. However, the instability in the manufacture of these superconducting devices is very troublesome. We can do this today and may not work tomorrow.