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近日,日月光研发中心的首席运行官何明东在接受媒体采访时表示,随着许多新的封装技术导入以满足市场需要,日月光(ASE)相信全球IC封装测试业的新时代已经到来,各种IC封装型式的呈现将更加促使产业间加强合作。随着摩尔定律缓慢地于2014年向16纳米工艺过渡,与之前5至10年相比较,由于终端电子产品市场的需求,IC封装的型式急剧增加,
In a recent interview with the media, He Mingdong, chief operating officer of ASE R & D Center, said ASE believes many new packaging technologies have been introduced to meet the needs of the market. The new era of IC packaging and testing industry in the world has come. Various IC packages The presentation of the type will further promote more cooperation among industries. As Moore’s Law slowly transitioned to the 16-nanometer process in 2014, the IC package type has dramatically increased due to the demand in the market for end-use electronics compared to the previous five to 10 years,