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一、前言 由石墨和铜构成的复合材料,一方面保持了石墨的弹性模量高、膨胀系数低和比重小的特点,又具有较大的导电和导热性能。因而,研制石墨/铜复合材料就有很大的实用意义。在电子工业中,这种石墨/铜复合材料因其导热性比铝好,它可以代替铜制造半导体的电极、基极等,因而可节约贵金属。并且,具有制造过程简单,也可使半导体小型化及缩短制造工艺过程。此外,该材料耐磨性也好,可用来制造干式滑动部件。
I. Introduction Composites made of graphite and copper, on the one hand to maintain the high elastic modulus of graphite, low expansion coefficient and the proportion of small features, but also has greater electrical and thermal conductivity. Therefore, the development of graphite / copper composites have great practical significance. In the electronics industry, the graphite / copper composites, because of their higher thermal conductivity than aluminum, can replace the electrodes, bases and the like of semiconductors made of copper, thereby saving precious metals. In addition, the manufacturing process is simple, the semiconductor can also be miniaturized, and the manufacturing process can be shortened. In addition, the material is also wear-resistant and can be used to make dry sliding parts.