论文部分内容阅读
以固体电解质硼硅玻璃与单晶硅和铝的连接为例 ,研究了玻璃—金属FDB连接过渡区的微观组织特征 ,分析了连接形成机理及主要工艺参数对连接过程的影响。提出了金属—氧化物过渡层—玻璃的接头结构形式及静电场条件下离子扩散及接合模型。测试采用SEM及超轻元素EDX、XRD ;试验采用专用键接焊机 ;工艺参数电压 4 0 0～ 80 0V ,外压力 0 .0 5～ 1MPa ,温度 2 5 0～ 4 0 0℃。研究认为 ,金属 /玻璃的界面接合成因于玻璃中负氧离子的扩散及界面复合氧化物的沉积形成。电压、温度、外压力及试件表面状态均是离子迁移和接合的主要影响因素。过渡区柱状组织结构对接合强度具有重要意义。
Taking the connection between the solid electrolyte borosilicate glass and monocrystalline silicon and aluminum as an example, the microstructural characteristics of the transition zone between the glass and the metal FDB were studied. The formation mechanism of the connection and the influence of the main process parameters on the connection process were analyzed. The joint structure of metal-oxide transition layer-glass and the model of ion diffusion and bonding under electrostatic field are proposed. The test uses SEM and ultra-light elements EDX, XRD; the test uses a special key welding machine; process parameters voltage 4 0 0 ~ 80 0V, external pressure 0 0 5 ~ 1MPa, temperature 250 ~ 4 0 0 ℃. It is believed that the metal / glass interfacial bonding is due to the diffusion of negative oxygen ions in the glass and the deposition of interfacial composite oxides. Voltage, temperature, external pressure and specimen surface state are the main factors of ion migration and bonding. The transition zone columnar structure is of great importance to the joint strength.