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液氮冲击中InSb面阵探测器表面经常出现局部分层、开裂等失效模式.为明晰材料分层、光敏元芯片断裂过程,基于三维等效建模设想,在易分层处添加内聚区模型,合理选取界面分层开裂参数,建立了128×128InSb探测器结构分层模型.模拟结果涵盖了典型碎裂照片中呈现的所有形变信息,即1)在光敏元阵列区域,复现出典型棋盘格屈曲模式;2)在Negative电极区域上方,InSb芯片与下层材料逐渐分开,且分层向两侧逐步扩展;3)在面阵探测器周边区域,表面起伏相对平整.上述模拟结果证明了所建分层模型的正确性和参数选取的合理性,为后续裂纹起源、传播过程的研究提供了模型基础.
In the liquid nitrogen impact, InSb surface array detector often has failure modes such as local delamination and cracking.In order to clarify the material delamination and the chip breakage of the photosensitive element, based on the assumption of 3D equivalent modeling, the cohesive zone Model, the layer delamination cracking parameters are reasonably selected, and a hierarchical model of 128 × 128InSb detector structure is established.The simulation results cover all the deformation information presented in the typical fragmented photos, namely 1) in the photosensitive element array area, 2) the InSb chip is gradually separated from the underlying material and delaminated to both sides above the Negative electrode area; 3) the surface roughness is relatively flat in the area surrounding the area array detector. The above simulation results demonstrate that The correctness of the stratified model and the rationality of parameter selection provide the model basis for the research on the origin and propagation of subsequent cracks.