论文部分内容阅读
针对玻璃微流控芯片制作中普遍存在的成本高、加工周期长等问题,提出了一种基于湿法腐蚀技术的低成本、实用化制作方法。该方法以商用显微载玻片作为基底材料,采用普通负性光刻胶RFJ-220为腐蚀掩模,通过优化光刻及湿法腐蚀工艺,可得到深度大于40μm(最深可达110μm),侧向钻蚀比为1.25∶1,表面粗糙度小于5.2nm的微沟道。重点解决了光刻胶与基底之间的粘附性问题,并分析了腐蚀液的配比及腐蚀方式等对沟道形貌的影响。整个制作工艺过程简单,成本低,稳定性好,可广泛应用于玻璃微流控芯片的制作中。
Aiming at the problems of high cost and long processing period in the fabrication of glass microfluidic chips, a low cost and practical method based on wet etching is proposed. The method takes a commercial microscope glass slide as a base material and uses a common negative photoresist RFJ-220 as an etching mask. By optimizing the lithography and wet etching processes, a depth of more than 40 μm (up to 110 μm) can be obtained, Lateral erosion ratio of 1.25: 1, surface roughness less than 5.2nm microchannels. Focusing on the adhesion between the photoresist and the substrate, and analyzing the effect of the ratio of the etching solution and the etching mode on the channel morphology. The entire production process is simple, low cost, good stability, can be widely used in the manufacture of glass microfluidic chips.