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为提升Cu-Ni-Sn合金的导电率,系统研究了溶质元素(Ni,Sn)含量对导电Cu合金导电率和硬度的影响。通过对现有典型牌号Cu合金进行成分解析,发现在Ni、Sn原子比为3/1时合金具有高的导电率和强度,故本工作固定Ni、Sn原子比为3,改变Ni和Sn总量,设计了一系列三元成分合金;采用真空电弧熔炼工艺制备合金锭,随后进行1093K/1h固溶+65%~75%变形冷轧+673K/2h时效处理。实验结果表明,经过固溶+变形+时效处理后的Cu合金的导电率随溶质元素(Ni+Sn)含量增加而降低,而硬度变化则呈相反趋势;系列Cu合金的弹性模量随(Ni+Sn)含量基本保持不变。由此,为使Cu合金的导电率不低于15.0%IACS、且保持一定的强度,溶质元素(Ni+Sn)含量应为10.0%≤y(Ni+Sn)≤16.0%(质量百分比含量为12.0%≤w(Ni+Sn)≤18.0%)。
In order to improve the conductivity of Cu-Ni-Sn alloy, the influence of solute element (Ni, Sn) content on electrical conductivity and hardness of Cu-Ni-Sn alloy was systematically investigated. By analyzing the composition of the existing typical Cu alloy, it is found that the alloy has high electrical conductivity and strength when the atomic ratio of Ni and Sn is 3/1. Therefore, the atomic ratio of Ni and Sn fixed in this work is 3, and the total amount of Ni and Sn is changed A series of ternary alloy were designed. The alloy ingot was prepared by vacuum arc melting process, followed by 1093K / 1h solution + 65% -75% deformation cold rolling and 673K / 2h aging treatment. The experimental results show that the conductivity of the Cu alloy after solution treatment + deformation + aging decreases with the increase of the content of the solute element (Ni + Sn), while the hardness changes with the opposite trend. The elastic modulus of the series of Cu alloys increases with (Ni + Sn) content remained unchanged. Therefore, the content of the solute element (Ni + Sn) should be 10.0% ≦ y (Ni + Sn) ≦ 16.0% (mass percentage content is not more than 15.0% IACS) and the electric conductivity of the Cu alloy is 15.0% 12.0% ≦ w (Ni + Sn) ≦ 18.0%).