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据《Simeconductor FPD World》2009年第11期报道,由于金刚石材料具有5.5 eV带隙的优异特性,作为低碳器件已引起人们的关注。目前的研究方向主要是单晶片的制作和实现降低功耗的功率器件。
According to “Simeconductor FPD World” 2009 eleventh, it has been reported that low-carbon devices have attracted people’s attention due to their excellent characteristics of 5.5 eV bandgap. The current research direction is mainly the production of single-chip and power devices to achieve reduced power consumption.