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一种以铜作为基板上面复合碳纤维的新的铜碳复合材料已在日本研制成功。这种复合材料的热膨胀率在2×10~(-6)/℃～12×10~(-6)/℃之间,它的热传导率也比金属铝优越。铜和碳的热膨胀是有很大差异的,但是经过特殊的热处理以后,这个问题得到了解决。同时,可以使碳纤维的纵、横方向热膨胀都相等。这种复合材料对用于半导体电极,硅颗粒连接面要求等方向性的情况下是很理想的。
A copper-based composite carbon fiber substrate above the new copper-carbon composite material has been successfully developed in Japan. The thermal expansion coefficient of this composite material is between 2 × 10 -6 / ℃ and 12 × 10 -6 / ℃. Its thermal conductivity is also superior to that of aluminum metal. The thermal expansion of copper and carbon is very different, but after a special heat treatment, this problem has been solved. At the same time, carbon fiber can be vertical and horizontal thermal expansion are equal. This composite material is ideal for use in semiconductor electrodes and silicon particles where the directionality is required.