论文部分内容阅读
IBM和爱立信日前联合发布公告,宣布成功推出了应用于未来5G基站的硅基毫米波相控阵集成电路。根据公告,该相控阵集成电路在28GHz毫米波频率下工作,并已经在相控阵列天线模块中成功演示,为未来5G网络铺平了道路。该产品是两家公司历时两年的合作成果,结合了IBM在高集成相控阵毫米波集成电路和天线封装解决方案的优势,以及爱立信在设计移动通信电路和系统的技术积累。
IBM and Ericsson recently announced a joint announcement that they have successfully introduced silicon-based millimeter-wave phased-array integrated circuits for future 5G base stations. According to the announcement, the phased-array IC operates at 28GHz millimeter-wave frequency and has been successfully demonstrated in phased-array antenna modules, paving the way for future 5G networks. The product, a two-year collaboration between the two companies, combines IBM’s strengths in highly integrated phased array millimeter-wave integrated circuits and antenna packaging solutions with Ericsson’s expertise in designing mobile communication circuits and systems.