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在文献[1]关于工业纯铝研究的基础上,研究了工业纯铜在不同条件下蠕变过程中晶界内耗峰的变化,蠕变条件分为三类:(a)较高温度、较低应力;(b)中等温度、中等应力;(c)较低温度、较高应力;使试样分别发生晶间型、混合型和穿晶型的断裂。 由晶界内耗峰的变化可以推知:在较高温度、较低应力的蠕变过程中,晶界强度变化不大;在中等温度、中等应力的蠕变过程中,晶界强度有一定程度的提高;在较低温度、较高应力的蠕变过程中,晶界强度则有比较显著的提高。这说明,在蠕变过程中,晶界强度是变化着的,在不同的蠕变条件下,晶界强化的程度不同,最终导致了不同类型的蠕变断裂。这对于“等强温度”概念是一个修正和补充。
Based on the literature [1] on industrial pure aluminum, the change of peak consumption in the grain boundary during the creep process of industrial pure copper under different conditions is studied. The creep conditions are divided into three categories: (a) higher temperature, Low stress; (b) Moderate temperature, medium stress; (c) Lower temperature, higher stress; make intergranular, mixed and transgranular fracture of the specimen. From the change of peak energy loss in the grain boundary, it can be deduced that the grain boundary strength does not change much in the creep process of higher temperature and lower stress. During the moderate and medium stress creep process, the grain boundary strength has a certain degree of Increase; in the lower temperature, higher stress creep process, the grain boundary strength is a more significant increase. This shows that in the creep process, the grain boundary strength is changing, under different creep conditions, the degree of grain boundary strengthening, eventually leading to different types of creep rupture. This is a correction and addition to the concept of “isothermal temperature”.