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10月7日,芯片代工厂台积电宣布选址南科台南园区兴建3nm晶圆厂。据台积电董事长张忠谋透漏,台积电此次将投资约200亿美元用于晶圆厂的建设,于2020年左右竣工,这也将成为全球首家3nm晶圆厂。2016年末至2017年初,三星与台积电先后推出10nm制程工艺,稳占手机芯片市场80%以上的市场份额。在这场角斗中,英特尔由于研发步伐稍微缓慢,错失了市场先机。即使后来推出的10nm工艺远超三星与台积电,但是对于整体市场来说,并没有太大影响。
October 7, chip foundry TSMC announced the selection of South Branch Tainan Park 3nm fab. According to TSMC chairman Zhang Zhongmou leaked, TSMC will invest about 20 billion US dollars for the construction of the fab, completed around 2020, which will also become the world’s first 3nm fab. From the end of 2016 to the beginning of 2017, Samsung and TSMC have introduced 10nm process technology, stabilizing the mobile phone chip market more than 80% market share. In this battle, Intel, due to the slow pace of development, missed the market opportunities. Even though the 10nm process that was introduced later goes well beyond Samsung and TSMC, it does not have much impact on the overall market.