据报道,2006年初沸沸扬扬的日本半导体大厂欲结盟进军全球晶圆代工市场的计划“日之丸半导体”,目前确定告吹,包括日本(Hitachi)、东芝(Toshiba)与瑞萨(Renesas)在内的3大日本半导体大厂,在6月底解散当初所成立的筹备处;虽然晶圆代工计划告终,但日前日厂也掀起合作研发下一代45 It is reported that the soaring Japanese semiconductor giant in early 2006 to join forces to enter the global foundry market plan, “Himawari Semiconductor” is currently set to blow, including Japan (Hitachi), Toshiba (Toshiba) and Renesas Within the three major Japanese semiconductor manufacturers, the dissolution of the original establishment of the preparatory office by the end of June; Although the foundry plan ended, but the Japanese plant has also recently set off cooperation to develop the next generation 45