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答:(2)部分贴片集成电路的封装外形,见表2所示。技能与技巧1:选择集成电路封装的技巧。引脚数20个以下首选SOIC封装。引脚数20～84个之间首选PLCC封装。引脚数大于84个的首选PQFP封装。穿孔安装首选DIP封装。技能与技巧2:SMT产品的潮湿敏感性分级。SMT产品的潮湿敏感性分级见表3所示。技能与技巧3:SO贴片集成电路的特点。
A: (2) Some SMD IC package shape, shown in Table 2. Skills and Skills 1: Choose integrated circuit packaging skills. Pin number 20 following the preferred SOIC package. Pins 20 to 84 between the preferred PLCC package. PQFP package with more than 84 pins. Perforated installation preferred DIP package. Skills and Skills 2: SMT product moisture sensitivity classification. The moisture sensitive classification of SMT products is shown in Table 3. Skills and skills 3: SO SMD integrated circuit features.