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AT&T公司在开关、信号传输产品中大量使用了混合集成电路,以提高集成度和可靠性,简化大系统的组装和测试。AT&T公司的新系统产品将采用一些I/O接头比现行设计多得多的混合集成电路,这些电路主要采用表面组装形式封装。我们正在为这些新的混合IC应用开发符合JEDEC标准的塑封系列产品。我们提供的混合IC在封装的外形和性能上都与分立IC相同,希望我们的用户能得到较大的好处。由于可用一些标准CAD库来确定部件布位、布线、焊接点尺寸和封装的电气特性,因此、系统设计可得到简化。由于可用工业标准设备进行电气测试、元件安放、回流焊、清洗和检查,因此可提高工艺性。总之,整个系统的可靠性得到了提高,因为在制造电路板时使用了标准元件、设备和优化工艺。AT&T公司还研究了68和124引线、1.27mm间距和132引线、635um间距的四方形封装的机械可靠性。结果表明,这三种封装都能承受几百次-40℃～+130℃的温度循环试验,而机械性能没有下降。目前正在做进一步的工作,就这些封装在厚薄膜金属化、厚薄膜、电阻、CBIC和CMOS丝焊IC、芯片电容和电阻、厚膜穿接、多层聚合物介质等方面进行全面考核。
AT & T makes extensive use of hybrid integrated circuits in switching and signaling products to improve integration and reliability, and to simplify the assembly and testing of large systems. AT & T’s new system products will use hybrid ICs with much more I / O connectors than the current design, which are mostly surface-mount packages. We are developing JEDEC-compliant plastic encapsulation products for these new hybrid IC applications. We provide a hybrid IC in the package shape and performance are the same with the discrete IC, I hope our users can get greater benefits. System design is streamlined because of the standard CAD libraries available to determine part placement, routing, solder point size and package electrical characteristics. Manufacturability is enhanced by electrical testing, component placement, reflow soldering, cleaning and inspection using industry standard equipment. In short, the reliability of the entire system has been improved because of the use of standard components, equipment and process optimization in the manufacture of circuit boards. AT & T also studied the mechanical reliability of quad-type packages with 68 and 124 leads, 1.27mm pitch and 132-lead, 635um pitch. The results show that these three packages are able to withstand hundreds of cycles of temperature cycling from -40 ° C to + 130 ° C with no reduction in mechanical properties. Further work is currently underway to fully evaluate these packages for thick film metallization, thick film, resistors, CBIC and CMOS wire-bond ICs, chip capacitors and resistors, thick film threading, and multi-layer polymer media.