文中研制的含磷铜球,不论采用轧制还是挤压后冷锻,其含磷量都可得到控制,其他杂质含量也可控制在YB TI铜标准以下,与进口者基本一致。经在引进的印刷线路板生产流水线上使用,效果与进口铜球一致。还可应用于光亮酸性镀铜工艺中,使用效果优于含磷铜板、棒。 The phosphorous-containing copper ball developed in this paper can be controlled for phosphorus content regardless of rolling or extrusion cold forging. The content of other impurities can also be controlled below the YB TI copper standard, which is basically the same as that of the importer. After the introduction of the printed circuit board production line use, the effect is consistent with the imported copper ball. Can also be used in bright acid copper plating process, the use of better than phosphorus copper, rods.