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近期国际知名服务器厂商纷纷推出和提升刀片式服务器产品线:IBM于去年12月8日发表了4颗Xeon处理器的刀片式服务器,同时IBM还表示其刀片式服务器计划将从Xeon处理器扩大到Power、Itanium 2处理器平台。Sun自2002年推出采用UltraSparc处理器的刀片式服务器后,去年推出采用AMD Opteron处理器的刀片式,今年将会把采用双核心UltrSparc处理器刀片式服务器推向市场。惠普的刀片式服务器目前包括Pentium-M处理器和Xeon处理器的产品,惠普也计划在今年推出Itanium 2平台的刀片式服务器,还计划推出采用全美达(Transmeta)处理器的刀片式服务器产品,并将推出可以容纳16片刀片的机箱。在国际厂商磨刀霍霍的同时,国内厂商也蠢蠢欲动,刀片式服务器市场风云再起。
Recently, well-known international server vendors have introduced and promoted the blade server product line: IBM last December 8 published four Xeon processor blade server, IBM also said its blade server program will be expanded from the Xeon processor Power, Itanium 2 processor platform. Sun, which introduced the AMD Opteron processor-based blade last year after introducing the blade server with the UltraSparc processor in 2002, will bring to market this year a dual-core UltrSparc processor-based server blade. Hewlett-Packard’s blades currently include Pentium-M processors and Xeon processors, and Hewlett-Packard also plans to introduce its Itanium 2-based blade servers this year and also plans to introduce blade servers using Transmeta processors, And will be introduced to accommodate 16 blade chassis. In the same time the international manufacturers sharpening, domestic manufacturers are ready to go, the blade server market revival.