研究了时效温度、时效时间以及冷变形对CuNiSiP合金时效性能的影响,并利用Gleeble-1500D热模拟试验机,采用高温等温压缩试验,研究了变形温度和变形速率对CuNiSiP合金高温压缩变形行为的影响。结果表明:CuNiSiP合金经冷变形后时效能得到较高的综合性能,其经60%变形450℃时效2h,显微硬度达到242HV0.05,导电率达到35.61%IACS;应变速率和变形温度的变化对合金的再结晶影响较大,变形温度越高,应变速率越小,合金越容易发生动态再结晶,其所对应的峰值应力相对越低。 The effects of aging temperature, aging time and cold deformation on the aging properties of CuNiSiP alloy were studied. The effect of deformation temperature and deformation rate on the deformation behavior of CuNiSiP alloy at high temperature was studied by means of Gleeble-1500D thermal simulator and high temperature isothermal compression test . The results show that the aging properties of CuNiSiP alloy after cold deformation get high comprehensive performance. The 60% deformation aged at 450 ℃ for 2h, the microhardness reached 242HV0.05 and the electrical conductivity reached 35.61% IACS. The strain rate and deformation temperature The recrystallization of the alloy has a great effect. The higher the deformation temperature is, the smaller the strain rate is. The more the recrystallization of the alloy occurs, the lower the corresponding peak stress is.