《高速电路PCB设计与EMC技术分析》

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从高速电路的特点出发,分析高速电路与低速电路的区别,进而概括出高速电路所面临的三大问题:电磁兼容、信号完整性和电源完整性。并对这些问题的来龙去脉及其危害做了详细的分析;最后,通过具体的实例将这些问题的解决方法贯穿到高速电路 PCB 设计的全过程之中。该书理论体系完整、内容翔实、语言通俗易懂,实例具有很强的针对性和实用性,既适用于电子信息类专业的 Starting from the characteristics of high-speed circuits, this paper analyzes the differences between high-speed circuits and low-speed circuits, and then sums up the three major problems that high-speed circuits face: electromagnetic compatibility, signal integrity and power integrity. And make a detailed analysis of the ins and outs of these problems and their harms. Finally, through the concrete examples, the solution of these problems runs through the whole process of high-speed circuit PCB design. The book theoretical system is complete, informative, language easy to understand, examples have strong relevance and practicality, both for electronic information professional
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