第四十二届国际电子装置会议(IEDM)日前在旧金山闭幕。在会议开幕之前,0.1微米已经开始出现,同时,在(IEDM)会议中有几篇关于电子业界将由目前的0.35微米的CMOS进展到0.1微米以下的论文发表。 然后,投资厂商即将推出新的装置类型、工艺、模型目标及有关技术,如硅绝缘体基质。具备上述重要条件 The 42nd International Electron Device Conference (IEDM) closed in San Francisco recently. 0.1 micron has begun to emerge before the opening of the conference, while several papers at the IEDM conference about the electronics industry going from the current 0.35 micron CMOS to less than 0.1 micron have been published. Investors will soon be introducing new device types, processes, model targets and related technologies such as silicon insulator substrates. Have the above important conditions