在超大规模集成电路的生产中,减少氧化膜CMP中的各种缺陷一直是工程师们的工作焦点之一。实际上这些缺陷的尺寸、形状、深度等能为我们寻找它们的根源提供许多有益的信息。例如:在肉眼下可见的长、直、深的划伤可能与研磨垫修整器有关;只有在先进的检测设备下才可见的轻微、连续的划伤与与研磨剂有关。对常见缺陷进行分类,并提供一些可见的缺陷产生机制,同时也讨论了如何通过日常检测来监视真正产品上的缺陷。 In the production of very large scale integrated circuits, reducing defects in the oxide film CMP has been one of the focuses of engineers. In fact, the size, shape, depth, etc., of these defects provide many useful information for us to find their root cause. For example, long, straight, and deep scratches visible to the naked eye may be related to pad dressers; only slight, continuous scratches visible under advanced testing equipment are related to abrasive. Classify common defects and provide some visible mechanisms for defect generation, as well as discuss how to monitor real-world defects through routine testing.