为满足新一代SiC基功率模块的先进封装需求,研究了Si3N4覆铜活性金属焊接(AMB)基板的界面空洞控制技术,使Si3N4陶瓷与铜箔界面处的空洞率低于1%。选用Ag-Cu-Ti活性金属焊片作为Si3N4覆铜基板的焊料层,其中的活性组分Ti可与Si3N4生成界面反应层TiN,该材料是界面空洞控制的关键。在分析界面空洞形成机理的基础上,
In this paper,the reliability of sense-switch p-channel flash is evaluated extensively.The endurance result indicates that the p-channel flash could be programmed and erased for more than 10000 cycles;the room temperature read stress shows negligible infl
采用气压浸渗法制备了热导率为850 W·m-1·K-1的铜-硼/金刚石复合材料翅片热沉,测试了其在自然冷却、强迫风冷和强迫水冷三种冷却模式下的散热效果。结果表明,热源功率越高,铜-硼/金刚石复合材料的散热效果越显著。在强迫水冷模式下,当加热片的输入功率为80 W时,使用铜-硼/金刚石复合材料翅片热沉时加热片的最高温度比使用铜翅片热沉时低14℃,比使用铝翅片热沉时低23℃。Icepak热模拟发现,在强迫水冷模式下输入功率为80 W时,与铜和铝翅片热沉相比,铜-硼/
采用GaAsPHEMT工艺,设计了一种700 MHz频段的高线性驱动放大器MMIC.该放大器内部集成了带通复合匹配网络结构的宽带输入匹配电路,通过两种幅频特性相反的匹配网络进行组合,有
A modulator is an essential building block in the integrated photonics,connecting the electrical with optical signals.The microring modulator gains much attention because of the small footprint,low drive voltage and high extinction ratio.An ultra-low V